FAIRS & EVENTS
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DRUPA May 28 - June 7, 2024, Dusseldorf, Germany - Booth No. 11D51Discover the Future of Technologies at DRUPA 2024 in Düsseldorf, Germany! Join us from May 28 to June 7, 2023, at the premier event for printing technologies. Explore our cutting-edge solutions, including digital die-cutting, designed to revolutionize your operations. Don't miss this opportunity to experience the exceptional quality and speed of our state-of-the-art equipment. Visit our booth and unlock the full potential of your capabilities. Mark your calendars for DRUPA 2024 in Düsseldorf and be part of the future of automation technologies! DRUPA 2024
PACK EXPO CHICAGO November 3 - 6, 2024, Chicago, Illinois, USA - Booth No. COMMING SOON!Discover the latest die-cutting solutions from BERHALTER Swiss Die-Cutting at PACK EXPO CHICAGO 2024, held from October 3 to 6 in Chicago, Illinois, USA. As industry leaders in precision and efficiency, we are excited to showcase our innovative die-cutting technologies to a global audience of professionals. Join us at PACK EXPO CHICAGO 2024 to stay at the forefront of packaging innovation. Experience firsthand how BERHALTER Swiss Die-Cutting is revolutionizing the industry with our advanced technology. Visit our booth to discover the future of die-cutting solutions. Don't miss this opportunity to connect with us at this exciting event! PACK EXPO CHICAGO 2024
NEWS & MEDIA
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Launch of the Swiss Die-Cutter™ B4! Redefining Die-Cutting TechnologyDesigned as a successor to the highly acclaimed B350, the Swiss Die-Cutter™ B4 embodies a new era of die-cutting excellence. The B4 can handle material rolls up to 430 mm wide. With a maximum speed of 500 strokes per minute, the B4, like the B6, is a testament to BERHALTER's commitment to innovation and pushing boundaries in the industry. Experience the power of automation, robotics, and IIoT in die-cutting with the Swiss Die-Cutter™ B4. Learn more about this game-changing machine and how it can transform your business. Stay ahead of the competition by embracing the future of precision and efficiency with BERHALTER's innovative solutions.
IN-FOCUS: BERHALTER Swiss Die-Cutting. A leading die-cutting technology company based in Widnau Switzerland ranked in our Product Launch category.
“BERHALTER is ranked in our Product Launch category this year off the back of the launch of the Swiss Die-Cutter™ B6 and the novel digital platform CUTcontrol™. Both demonstrate the firm’s commitment to incorporating new technology into its product lines and providing customers with more control and visibility over the manufacturing process.” PACKAGING GATEWAY Packaging Gateway Excellence Awards and Rankings 2022 - The Verdict
BERHALTER Swiss Die-Cutting is among the Top 10 Industrial IoT Solution Providers in Europe 2021. The annual listing of 10 companies that are at the forefront of providing Industrial IoT Solutions and impacting the industry.
Gaining more from less at a faster rate while maintaining quality standards will make businesses much more manageable. There has been a shift in global food and beverage brands’ approach where they are looking to decentralize their production to produce a higher number of different products in lower volumes. This calls for higher flexibility from the available machinery and equipment. On the other hand, the packaging volume is increasing because the packaging size is getting smaller. Hence, the demand for machines with ultimate precision for high volumes is gaining traction. In this race to gain an advantage over the competition by achieving more from less, businesses are looking for help from experienced companies like Berhalter that have a proven record of delivering high levels of business impact through their innovative die-cutting offerings. MANUFACTURING TECHNOLOGY INSIGHTS - For a Smarter and Optimized Die-cutting
Video interview with Dalibor Schuman, managing director at BERHALTER Swiss Die-Cutting on packaginginsights.com
Dalibor Schuman, managing director at BERHALTER Swiss Die-Cutting, outlines the Swiss die-cutting specialist's most advanced machine to date - the B6 - which combines the latest technology, intelligence and performance. Schuman also discusses Berhalter's CUTcontrol™ IIoT platform for predictive and preventive maintenance and use of robotics, and ponders the future of die-cutting solutions. Packaging Insights
CUTcontrol™, the IIoT digital service platform by BERHALTER Swiss Die-Cutting in the business magazine ECO from SRF - Swiss Television. Digitalization - New income for SMEs, the construction industry has to rethink
SMEs equip their machines with sensors and can therefore monitor them continuously. A service for customers that brings new income. The price war is troubling Swiss SMEs; in global competition there are always competitors in other countries who produce more cheaply. Now the first companies are rethinking, and digitization is helping them: They are equipping their machines with sensors which means they can monitor them continuously - and sell customers new digital services on a subscription basis. This leads to new earnings that bring even higher margins. In addition, live in the «ECO» studio, CEO of Microsoft Switzerland, Marianne Janik.
Market launch - Swiss Die-Cutter™ B6 High-Performance Die-Cutting Machine
With the Swiss Die-Cutter™ B6 die-cutting system, we are bringing a new generation of machines with world-firsts onto the market. As a successor to the B600, the Berhalter Swiss Die-Cutter™ B6 makes its strongest statement yet in terms of technology, intelligence and performance. The currently most powerful and innovative high-performance die-cutting machines define a new design language: innovative, dynamic and intelligent. With the future-oriented design and the fully digital punch drive, a unique accessibility to the die-cutting substrate is possible.
Next Generation Ahead - BEAMstack™ automated packaging systems and robotics
Everybody's talking about Industry 4.0. With the latest generation of our BEAMstack™ Packaging Robot we have created an automated packaging system that impressively combines the increasing requirements for productivity as well as ever increasing hygienic standards. Since 2010, we have been using robotics to separate the die-cut stacks to the desired number of pieces and to automatically package them into a plastic blister or a cardboard box. Man thinks, machine steers.
IIoT Platform - CUTcontrol™ Intelligent Support System for Die-Cutting Data Analysis
Our revolutionary IIoT Platform CUTcontrol™ serves as a benchmark of die-cutting systems for productivity and efficiency. The web-based software assumes the role of support system and uses diagnostic tools for data analysis. The data streams come from machines, options and die-cutting tools and can easily be converted into valuable information using dashboards. CUTcontrol™ offers all functions required for checking the machine and tool condition: from error detection, error handling and messaging through to spare parts management.
Need food for thought? Find out what moves experts in the industry and what the professional world thinks about current topics and the latest trends.
- June 12, 2020