Fairs & Events

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drupa Düsseldorf
Hall 11 Booth C60

April 20 - 30, 2021
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Market launch - Swiss Die-Cutter™ B6 High-Performance Die-Cutting Machine

With the Swiss Die-Cutter ™ B6 die-cutting system, we are bringing a new generation of machines with world-firsts onto the market. As a successor to the B600, the Berhalter Swiss Die-Cutter™ B6 makes its strongest statement yet in terms of technology, intelligence and performance. The currently most powerful and innovative high-performance die-cutting machines define a new design language: innovative, dynamic and intelligent. With the future-oriented design and the fully digital punch drive, a unique accessibility to the die-cutting substrate is possible.

Next Generation Ahead - BEAMstack™ automated packaging systems and robotics

Everybody's talking about Industry 4.0. With the latest generation of our BEAMstack™ Packaging Robot we have created an automated packaging system that impressively combines the increasing requirements for productivity as well as ever increasing hygienic standards. Since 2010, we have been using robotics to separate the die-cut stacks to the desired number of pieces and to automatically package them into a plastic blister or a cardboard box. Man thinks, machine steers.

IIoT Platform - CUTcontrol™ Intelligent Support System for Die-Cutting Data Analysis

Our revolutionary IIoT Platform CUTcontrol™ serves as a benchmark of die-cutting systems for productivity and efficiency. The web-based software assumes the role of support system and uses diagnostic tools for data analysis. The data streams come from machines, options and die-cutting tools and can easily be converted into valuable information using dashboards. CUTcontrol™ offers all functions required for checking the machine and tool condition: from error detection, error handling and messaging through to spare parts management.

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